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| Surface Mount PPTC FSMD 0805 Series FEATURES * 0805 size Surface Mount *Application: All high-density boards *Operation Current: 100mA ~ 350mA *Maximum Voltage: 6V ~ 15V *Temperature Range: -40C to 85C *RoHS Compliant RoHS u AGENCY RECOGNITION *UL (Pending) *C-UL (Pending) *TUV (Pending) ELECTRICAL CHARACTERISTICS (23C) Part Number FSMD010-0805 FSMD020-0805 FSMD035-0805 Hold Current IH, A 0.10 0.20 0.35 Trip Current IT, A 0.30 0.50 0.75 Rated Voltage VMAX, Vdc 15 9 6 Maximum Current IMAX, A 100 100 100 Typical Power Pd, W 0.5 0.5 0.5 Max Time to Trip Current Amp 0.50 8.00 8.00 Time Sec 1.500 0.02 0.10 Resistance Tolerance RMIN R1MAX OHMS 0.70 0.40 0.25 OHMS 6.000 3.500 1.200 IH=Hold current-maximum current at which the device will not trip at 23C still air. IT=Trip current-maximum current at which the device will always trip at 23C still air. V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX). I MAX=Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23C still air environment. R MIN=Minimum device resistance at 23C prior to tripping. R1MAX=Maximum device resistance at 23C measured 1 hour post trip. Termination pad characteristics Termination pad materials: solder-plated copper FSMD PRODUCT DIMENSIONS (MILLIMETERS) B Marking A B D Part Number FSMD010-0805 FSMD020-0805 FSMD035-0805 2.00 2.00 2.00 A 2.2 2.2 2.2 1.20 1.20 1.20 B 1.5 1.5 1.5 C Max D Min Min Max Min Max Min 0.20 0.55 1.00 0.20 0.55 1.00 0.20 0.47 0.75 RFE International * Tel:(949) 833-1988 * Fax:(949) 833-1788 * E-Mail Sales@rfeinc.com C5ED01 2008.1.30 Surface Mount PPTC FSMD 0805 Series THERMAL PRODUCT DIMENSIONS (MILLIMETERS) Thermal Derating Curve, FSMD0805 Series 200% RoHS u Percent of Rated Hold and Trip Current 150% 100% 50% A= FSMD 075, 100 B= FSMD 014, 020, 035 & 050 40 20 0 20 40 60 80 0% Ambient Temperature (C) TYPICAL TIME-TO-TRIP AT 23C A 100 10 Time-to-trip (S) B C 1 0.1 0.01 0.001 0.1 1 Fault current (A) 10 A = FSMD010 - 0805 B = FSMD020 - 0805 C = FSMD035 - 0805 PAD LAYOUTS, SOLDER REFLOW AND REWORK RECOMMENDATIONS The dimensions in the table below provide the recommended pad layout for each FSMD 1812 device NOMINAL PAD DIMENSIONS (MILLIMETERS) SOLDER RELOW Solder Reflow Due to "Lead Free" nature, Temperature and Dwelling time for the soldering zone is higher than those for regular. This may cause damage to other components. 1. Recommended maximum past thickness is 0.25mm. 2. Devices can be cleaned by using standard industry methods and solvents. 3. Storage Environment: <30C / 60% RH solvents. Caution: If reflow temperatures exceed the recommended profile, devices may not meet performance requirements. Devices are not designed to be wave soldered to the bottom side of the board. Rework: Use standard industry practices. NOTE: All Specification subject to change without notice. RFE International * Tel:(949) 833-1988 * Fax:(949) 833-1788 * E-Mail Sales@rfeinc.com C5ED01 2008.1.30 |
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